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Dublin, Sept. 14, 2017 (GLOBE NEWSWIRE) -- The "Advanced IC Packaging Technologies, Materials and Markets - 2017 Edition" report has been added to Research and Markets' offering.
Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition reveals the latest technology and market trends in the IC packaging industry by focusing on the most advanced packaging products and solutions-those critical to success in developing cutting-edge products and in maintaining technological leadership. Every market or application segment discussed in the report includes quantitative analysis based on the most current historical years, 2015 and 2016, as well as forecasts from 2017 through 2021. Each of the six chapters examines the market from a different perspective.
The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today's users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.